Manufacturing GaN Epi wafers has gone through a long and windy process and have reached maturity to some extent to be able to produce low-cost devices. There is so much more to be done to create scalable (to 8-inch, 12-inch, and larger GaN Epi wafers), high quality material to be able to make devices with higher breakdown voltages, higher current and higher frequency to address larger application domains. We will review the available methods currently in practice and the new and upcoming technologies in creating GaN membranes to apply to future applications.
Presented by Satya Dixit, Board Member and Advisor at Future Semiconductor Business (FSB)
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